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KM ACC 250

Vendor: KEMIA - SINGAPORE

Type: Surface activation

A substance that removes excess tin salts on the plastic surface after the palladium film forming process.

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KM ACC 250 - A substance that removes excess tin salts on the plastic surface after the palladium film forming process.
Application:

  • KM ACC 250 is used to remove excess tin from plastic surface after palladium film forming process.
  • KM ACC 250 is applied to the plating process on PC and ABS plastic, specifically after the palladium film forming process.
  • KM ACC 250 is widely used in factories from small-scale manual to semi-automatic and fully automatic.

Advantages:

  • KM ACC 250 removes excess tin from the plastic surface after the palladium film forming process to help the subsequent plating process to be plated evenly and more tightly.
  • KM ACC 250 helps promote membrane activation.
  • KM ACC 250 removes excess tin from the zig holder to avoid plating on the zig holder to save chemicals.
  • KM ACC 250 has low new phase content to save costs.
  • KM ACC 250 has 1 component so additional use is also easy.

Contact:
METATECH MATERIAL TECHNOLOGY JOINT STOCK COMPANY
Hanoi office address: S02 - D'Eldorado Building 1, 659A Lac Long Quan, Xuan La Ward, Tay Ho District, Hanoi City
HCM office address: 86/59 Pho Quang, Ward 2, Tan Binh District, Ho Chi Minh City.
Website: https://metatech.vn
Fanpage: https://www.facebook.com/metatechvietnam
Hotline in Hanoi area: 0988.956.546 or 0989.491.366
Hotline in HCM area: 0963.867.366 or 0969.678.756